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Home > EMI MATERIALS > Special Thermally & Electrically Conductive Silico
CR TMEM-SA-605LS
Product description
The silicone thermal conductive and electrically conductive adhesive specially for target bonding is a thermal and electrically conductive silicone adhesive formulated with silicone adhesive as the main raw material, incorporated with powder fillers featuring excellent heat resistance, thermal conductivity and electrical conductivity. It is applied in scenarios where electrical insulation is not required. Its unique grain orientation and plate-like structure enable this product series to closely conform to various contact surfaces, thereby achieving maximum heat transfer performance. It boasts superior adhesion to a wide range of metallic and non-metallic substrates. It can be fully cured at 150°C within 10 minutes, and the curing time shortens as temperature rises. This product is completely non-toxic, eco-friendly, and complies with RoHS environmental requirements.
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Properties and Applications
Properties:
EMI shielding performance
Good heat transfer capability
Excellent adhesion to aluminum, copper, stainless steel, glass and other substrates
Stable chemical and mechanical properties


Applications:
Target bonding
Typical performance

View typical performance
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