CR TMEM-EA-701
Product description
This epoxy modified thermally and electrically conductive adhesive specially for target bonding is formulated with epoxy modified adhesive as the main raw material, incorporated with powder fillers featuring excellent heat resistance, thermal conductivity and electrical conductivity. It is a thermally and electrically conductive epoxy modified adhesive designed for applications where electrical insulation is not required.
Its unique grain orientation and plate-like structure enable this product series to closely conform to various contact surfaces, thereby maximizing thermal conduction performance. It exhibits outstanding adhesion to a wide range of metallic and non-metallic substrates.
The product can be cured at room temperature or under heating conditions; the curing time shortens as temperature rises. This series is completely non-toxic, eco-friendly and compliant with RoHS environmental requirements.
Properties and Applications
Properties:
Room-temperature target bonding and room-temperature curing available
EMI shielding function and excellent thermal transfer performance
Good adhesion to aluminum, copper, stainless steel, glass and other substrates
Stable chemical and mechanical properties
Applications:
Target Bonding
Typical performance
View typical performance
Recommended products
