CR TM-SAH-1200 is a one-component addition-curable heat-curing paste-like thermally conductive adhesive, formulated with silicone adhesive as the primary raw material, filled with powder fillers featuring outstanding heat resistance, electrical insulation and thermal conductivity.
This product delivers high thermal conductivity and reliable bonding performance for electronic devices. After high-temperature curing, it forms a high-hardness elastomer that closely adheres to contact surfaces to reduce thermal resistance, and provides strong adhesion to various metallic and non-metallic substrates such as copper, aluminum and stainless steel.
It achieves full curing within 30 minutes at 150°C, and curing time shortens as temperature rises. Its cured compound is non-corrosive to metallic and non-metallic surfaces, making it suitable for electronic encapsulation applications requiring high temperature resistance and stable thermal management.