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RTV Silicone Ag/Cu Conductive Adhesive /CR EMSG‑201
Product description
CR EMSG‑201 is a one‑component, moisture‑curable silicone silver‑coated copper conductive adhesive for room‑temperature application. It can be formed via the FIP dispensing process. Its low viscosity enables short production cycles on all types of dispensing machines. The surface‑dry time and full‑cure time decrease with rising temperature and humidity. It delivers outstanding shielding performance and excellent bonding strength, and offers favorable cost‑performance compared with pure‑silver materials.
Sample application Quotation application
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Properties and Applications
Properties:
Dispensable for forming on metal or plastic substrates
Excellent electromagnetic‑shielding performance
Good thixotropy and adhesion


Applications:
Military electronic devices
Aerospace and marine equipment
Automotive electronic products
Typical performance

View typical performance
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