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Home > TIM MATERIALS > Thermally conductive encapsulant product series
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0527-84506617

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17768925933

Epoxy Thermally Conductive Encapsulant
Product description
Epoxy thermal encapsulants are made of epoxy resin as matrix, and filled with composite ceramic powder or aluminum powder materials. this product has very high adhesion to various metallic and non-metallic surfaces. It can be cured at room temperature or by heating, and the higher the temperature, the faster the curing. Fully compliant with EU RoHS Directive requirements. In addition to the characteristics of high thermal conductivity, this product also has the characteristics of low thermal expansion rate. It has excellent flow and leveling properties before curing.
Sample application Quotation application
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Properties and Applications
Properties：
Good substrate adhesion
For various potting modes
Excellent resistance to physical shock
Low viscosity, no exudation after curing
Low stress, effective protection of electrical components

Applications：
Power Modules
LED luminaires
LED lighting assembly
LED driver
Photovoltaic modules

Typical performance
View typical performance
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