Epoxy Thermal Conductive Adhesive / CR TMEA-2200
Product description
CR TMEA-2200 epoxy thermal conductive adhesive is formulated with epoxy resin as the matrix and filled with composite thermally conductive powder. This product delivers exceptionally high adhesion to various metallic and non-metallic substrates. It can cure at room temperature or be accelerated by heating; the curing rate increases with temperature. It fully complies with EU RoHS directives.
Besides its high thermal conductivity, the cured material features a low coefficient of thermal expansion. It offers favorable workability before curing, making it suitable for electronic component encapsulation applications that require both thermal management and precision molding.
