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HTV Silicone Ag/Ni Conductive Glue
Product description
CR EMSG-131 series is high temperature curing silicone conductive glue filled with silver coated nickel powder. Available in one-part and two-part. It can be formed by FIP dispensing process. With low viscosity, it can guarantee short production cycle on any type of dispenser. At 150℃, it can be fully cured in 40 minutes, and the curing time shortens with the increase of temperature. It is suitable for occasions with high requirements for shielding and can be used in harsh environments.
Sample application Quotation application
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Properties and Applications
Properties：
Can be dispensed on metal or plastic substrates
Excellent electromagnetic shielding performance
Good thixotropy and adhesion

Applications：
Military electronic equipment
Aviation and marine equipment
Automotive Electronics
Typical performance
View typical performance
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