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HTV Silicone Ag/Glass Conductive Glue
Product description
CR EMSG-111 series is silicone conductive glue filled with silver coated glass conductive powder. Available in one-part and two-part. It can be formed by FIP dispensing process. With low viscosity, it can guarantee short production cycle on any type of dispenser. At 150℃, it can be fully cured in 40 minutes, and the curing time shortens with the increase of temperature. It has excellent shielding effectiveness and good mechanical properties at the same time. Compared with Ag/Cu conductive glue, it has a higher cost performance and can be used in environments where the use conditions are not very harsh.
Sample application Quotation application
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Properties and Applications
Properties：
Suitable for FIP dispensing, saving labor and eliminating irrelevant waste
Can be dispensed on metal or plastic substrates
Excellent electromagnetic shielding performance
Good thixotropy and adhesion

Applications：
Electronic medical equipment
Communication base station
Entertainment electronics
Automotive Electronics

Typical performance
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