Epoxy Thermal Conductive Potting Compound / CR TM-EPotting-2100
Product description
CR TM-EPotting-2100 epoxy thermal conductive potting compound is based on epoxy resin and filled with composite thermal conductive powders or aluminum powder.This product exhibits high adhesion to various metallic and non-metallic substrates, supports curing at room temperature or accelerated curing by heating, with a faster curing rate at higher temperatures, and fully complies with the EU RoHS Directive.In addition to its high thermal conductivity, the cured product features a low coefficient of thermal expansion, while the uncured product demonstrates excellent flow and leveling properties.It is suitable for the encapsulation of electronic components that require both thermal management and precision molding.
Properties:
Good adhesion to substrates
Suitable for various potting applications
Excellent resistance to physical impact
No exudation after curing
Low stress, effectively protects electronic components
Applications:
Power modules
LED lamps
LED lighting components
LED drivers
Photovoltaic modules
