Thermally Conductive Epoxy Potting Compound / CR TM-EPotting-2150
Product description
CR TM-EPotting-2150 epoxy thermally conductive potting compound is formulated with epoxy resin as the base matrix, filled with composite thermally conductive powder or aluminum powder fillers.
This series delivers ultra-high adhesion to various metallic and non-metallic substrates. It can cure at room temperature or with heating for accelerated crosslinking; higher temperatures bring faster curing speed, and the product fully complies with EU RoHS directives.
Apart from high thermal conductivity, its cured solid features low thermal expansion coefficient. Before curing, it exhibits outstanding fluidity and leveling performance, making it suitable for encapsulation of electronic components that require both thermal management and precision molding.
