Epoxy-Modified Thermally and Electrically Conductive Adhesive dedicated to target bonding is a thermally & electrically conductive epoxy-modified adhesive formulated with epoxy-modified adhesive as the primary raw material, filled with powder fillers featuring excellent heat resistance, thermal conductivity and electrical conductivity.
It is suitable for application scenarios without electrical insulation requirements. Thanks to its unique grain orientation and plate-like filler structure, this product series can closely conform to various contact surfaces, thus maximizing heat transfer performance. It delivers ultra-high adhesion to a wide range of metallic and non-metallic substrates.
It can be cured either at room temperature or under heating; curing time shortens as temperature increases. This entire product series is completely non-toxic, classified as eco-friendly green materials and fully compliant with RoHS environmental directives.