Thermally Conductive Silicone Potting Compound / CR TM-SPA-2200
Product description
CR TM-SPA-2200 is a silicone insulating potting compound manufactured with silicone adhesive as the primary raw material, filled with powder fillers featuring outstanding heat resistance, electrical insulation and thermal conductivity. It delivers excellent thermal conductivity and strong bonding performance for electronic devices.
This product cures under high temperature and achieves high hardness after curing. Once fully cured, it fits tightly against contact surfaces to reduce thermal resistance, and exhibits high adhesion to various metallic and non-metallic substrates. It boasts excellent fluidity and homogeneity prior to curing. After crosslinking, the material will not detach from protective housings even under alternating hot and cold operating cycles.
